Pre-soldering services - メーカー・企業と製品の一覧

Pre-soldering service [Bumping service]

High-quality bumping service provided by our independently developed screen printing machine!

The pre-solder service [bumping service] utilizes printing machines and precision bumping machines developed in-house to form fine solder bumps on substrates. We have established an environment that allows for the provision of stable quality products by installing equipment in a clean room managed at Class 10,000. The main processes are as follows: 1. Micro bump formation through solder paste printing (Main achievements) - Formation of 150μm pitch bumps on organic substrates - Formation of 100μm pitch bumps on silicon wafers 2. Flux cleaning using water-based cleaning agents (Main achievements) - Flux cleaning of organic substrates/wafers after micro bump formation - Flux cleaning of automotive/medical substrates after component mounting 3. Flattening of micro bumps using precision press machines 4. Visual inspection of micro bumps 5. Foreign matter inspection using appearance inspection machines *For more details, please download the materials or contact us.